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SF-C16TV-D2.0
SINCEREFIRST
This compact endoscope camera module is designed for OEM equipment that needs real-time imaging through a narrow access path. The steel-shell camera head measures Φ2.0 × 6.0mm and combines a 1/18-inch CMOS sensor with four LEDs. It outputs 400 × 400 images at 30fps and provides a 5–50mm depth of field for close-range observation inside small cavities, channels and assemblies.
The module includes a 2m camera cable and connects to a matching processing board. USB UVC and analog video configurations can be evaluated according to the host device, display architecture and connector requirements. A shell-free 1.05 × 1.05 × 5.0mm imaging unit is also available for projects that require a smaller embedded footprint and provide their own mechanical protection.
This product can be integrated into industrial inspection tools, precision instruments and medical-device development projects. The suitability of the complete device—including sealing, electrical safety, material compatibility, cleaning or sterilization method and regulatory compliance—must be validated by the equipment manufacturer.
Φ2.0mm steel-shell camera head for narrow access paths
400 × 400 imaging at up to 30 frames per second
120° diagonal and 87.5° horizontal field of view
5–50mm depth of field for close-range observation
Four front LEDs for viewing in unlit cavities
0.6W power consumption for compact equipment integration
2m camera cable with a separate 50 × 24mm main board
USB UVC or AV output configuration for different host systems
Shell-free imaging unit available for custom mechanical packaging
The assembled steel-shell tip has an outside diameter of 2.0mm and a length of 6.0mm. The compact cross-section allows the camera to enter narrow passages where a conventional borescope head may not fit. Four LEDs are arranged at the front to illuminate the viewing area.
The 2mm dimension refers to the outside diameter of the camera head, not the cable, processing board or completed endoscope. The equipment designer should allow for insertion clearance, cable movement and any protective tube, articulation section or distal-tip structure used in the final device.
For embedded designs with their own protective housing, the imaging unit is available without the outer steel shell. Its listed dimensions are 1.05 × 1.05 × 5.0mm. This option gives the integrator more control over the final distal-tip geometry, but it also requires suitable support, sealing, strain relief and protection against handling damage.
The shell-free unit should not be treated as a finished probe. Mechanical loads must be carried by the end product rather than transferred directly to the sensor, lens or signal cable.
The 1/18-inch CMOS sensor provides an active image of 400 × 400 pixels, equivalent to approximately 0.16MP. At up to 30fps, the module can provide live visual feedback while the probe moves through a cavity or while the inspected component is repositioned.
Image quality depends on more than pixel count. Working distance, lens cleanliness, LED level, surface reflectivity, host-side processing and display scaling all affect the visible result. A sample should therefore be tested with the actual target materials and viewing distance before the image specification is approved.
The listed signal-to-noise ratio is greater than 36.8dB, with a dynamic range of 65.8dB. TV distortion is specified at less than -11%. These values help define the imaging baseline, but the camera output should not be used as a dimensional measurement system unless the final equipment has been calibrated for that purpose.
The optical system provides a 120° diagonal field of view and an 87.5° horizontal field of view. This wide-angle coverage helps the operator see more of a nearby cavity without requiring the camera head to move as far from side to side.
Wide-angle imaging naturally changes perspective near the edge of the frame. If the application involves defect sizing, dimensional comparison or machine-vision analysis, the equipment developer should evaluate distortion correction and calibration using the final lens, board and software configuration.
The listed depth of field is 5–50mm, with an F-number of 5.0. This range is suited to close observation of surfaces located a few millimeters to several centimeters from the lens. The preferred working distance still depends on the required detail, illumination level and reflectivity of the target.
Objects placed closer than the specified range may appear soft, while distant objects will occupy fewer pixels and show less detail. Sample validation should use the real inspection distance rather than a general room scene.
Four LEDs are integrated around the front of the 2mm steel-shell camera head. They provide local illumination when the probe is used inside an unlit cavity. The product specification lists operation at 0 Lux when the integrated LEDs are active.
LED intensity should be matched to the target surface. Highly reflective metal, wet surfaces and pale biological materials can create glare when the light is too strong, while dark or absorbent surfaces may need a higher output. An adjustable-light board can be selected when the equipment requires the operator or control system to change brightness.
Illumination performance should be checked after the camera is installed behind any window, cover or protective distal-tip component. These parts can alter brightness, reflections and color response.
The camera head connects through a 2m cable to a separate main board measuring approximately 50 × 24mm. This architecture keeps the distal tip small while moving signal processing and host connection away from the inspection area.
The board needs suitable space, electrical insulation, strain relief and airflow inside the completed equipment. Cable routing should avoid repeated sharp bends, crushing and tensile loads near the camera head or board connection.
A USB 2.0 UVC board can be selected for compatible host systems that accept standard USB video input. The current configuration information lists Windows, macOS and Android support. The customer should still verify the exact operating-system version, USB host or OTG function, connector type, video format and application software before approving the sample.
For other driver-free digital products, review the wider USB endoscope camera module range.
An AV processing-board configuration can be evaluated for equipment built around composite video input, such as dedicated displays or existing inspection systems. The connector and video standard must match the target host. Buyers developing an analog architecture can compare the available AV endoscope camera modules before final selection.
The output board, connector, cable length and video format should be recorded in the approved specification so that samples and production units use the same configuration.
The module is listed for a 4.8–5.2V supply and power consumption of approximately 0.6W. The supply should remain within the specified range and provide stable current to the imaging circuit and LEDs. Noise from motors, switching regulators or long ground paths can affect video performance, so the camera should be evaluated in the complete electrical system rather than only on a bench supply.
The listed component operating-temperature range is -20°C to 70°C. This is an electronic operating range, not a sterilization rating and not a guarantee for the finished device. Enclosure temperature, LED duty cycle, board ventilation, cable materials and neighboring heat sources must be considered during integration.
If the camera will be exposed to liquid, pressure, cleaning agents, disinfectants or repeated temperature cycling, the complete probe assembly requires separate sealing and durability validation. No waterproof or sterilization rating should be inferred from the camera-head diameter or steel shell alone.
The compact camera head can support inspection equipment used for narrow tubes, small machined passages, electronic assemblies, miniature mechanisms and other confined structures. The 5–50mm working range is intended for close observation rather than long-distance pipe surveying.
For environments involving water, oil, dust, pressure or abrasive contact, the equipment designer should add appropriate protection and qualify the finished probe. More application-specific options are available within the industrial endoscope camera module range.
The separate camera head and processing board can be incorporated into laboratory tools, maintenance instruments, optical-cell inspection equipment and compact visualization systems. The wide field of view helps with orientation, while the square 400 × 400 output can suit interfaces that prioritize a compact imaging channel.
The small imaging unit may be evaluated as a component for medical or veterinary visualization equipment. It is not, by itself, a complete medical device. The device manufacturer is responsible for determining the required materials, biocompatibility, sealing, cleaning or sterilization method, electrical safety, risk controls, clinical performance and regulatory pathway.
Different equipment platforms may require changes to the mechanical, optical or electrical configuration. Available engineering discussions can cover:
Steel-shell or shell-free camera-head structure
Distal-tip diameter and package length
Cable length and strain-relief design
USB UVC or AV processing board
Host connector and pin definition
Field of view and working-distance requirements
LED quantity, brightness control and color characteristics
Image orientation, color tuning and exposure behavior
Main-board shape and installation space
Sample quantity and production-volume requirements
Each change can affect image performance, signal stability, tooling, validation work, unit cost and lead time. Use the custom endoscope camera module development service when the standard configuration does not match the intended device.
Parameter | Specification |
|---|---|
Product Type | 2mm endoscope camera module |
Sensor Type | CMOS |
Sensor Size | 1/18 inch |
Resolution | 400(H) × 400(V), approximately 0.16MP |
Frame Rate | Up to 30fps |
Field of View | 120° diagonal × 87.5° horizontal |
Depth of Field | 5–50mm |
F-number | 5.0 |
TV Distortion | < -11% |
Illumination | Four front LEDs |
Minimum Illumination | 0 Lux with LEDs active |
Signal-to-Noise Ratio | >36.8dB |
Dynamic Range | 65.8dB |
Steel-Shell Head Size | Φ2.0 × 6.0mm |
Shell-Free Unit Size | 1.05 × 1.05 × 5.0mm |
Main Board Size | Approximately 50 × 24mm |
Cable Length | 2m standard listing; other lengths subject to evaluation |
Output Options | USB 2.0 UVC or AV processing-board configuration |
USB Host Support | Windows, macOS and Android, subject to host validation |
Supply Voltage | 4.8–5.2V |
Power Consumption | Approximately 0.6W |
Operating Temperature | -20°C to 70°C at component level |
A camera module should be evaluated as part of the intended device rather than selected from diameter and resolution alone. A practical approval process includes:
Confirm the available distal-tip space and required insertion clearance.
Define the target distance, field of view and smallest feature to be observed.
Select the shell, LEDs, cable, processing board and host connector.
Test the sample with the actual target surfaces and lighting conditions.
Check image orientation, color, exposure, glare and edge distortion.
Verify video stability on the target host and software platform.
Test cable routing, strain relief and repeated handling in the prototype.
Validate temperature rise during the required operating cycle.
Complete any sealing, cleaning, electrical-safety or regulatory testing required for the final device.
Freeze the approved mechanical and electrical specification before batch production.
SincereFirst can coordinate sample development and production review against the agreed specification. Inspection criteria should identify the approved camera head, board, cable, connector, image settings and functional test method.
No. It refers to the listed outside diameter of the steel-shell camera head. A finished endoscope may be larger after adding a protective tube, articulation structure, working channel, outer jacket or other distal-tip components.
It can connect to a compatible host when supplied with the appropriate USB 2.0 UVC processing board and connector. Confirm USB host or OTG support, operating-system version, accepted video format and application software during sample testing.
Other cable lengths can be evaluated, but a longer or differently constructed cable may affect signal integrity, flexibility, outside diameter and system noise. The required length and routing conditions should be provided before the board and cable design are confirmed.
The available product information does not establish a waterproof rating for the finished probe. The final equipment developer must define and validate the sealing method, immersion depth, pressure, exposure time and resistance to any cleaning fluid or process chemical.
It is intended for integration into a customer-designed structure. The final assembly should support the imaging unit, protect the lens and sensor, control adhesive or sealing processes and prevent cable loads from reaching delicate connections.
It may be evaluated as an imaging component, but medical use depends on the complete device design and its intended purpose. The medical-device manufacturer must complete the applicable risk management, material, electrical-safety, cleaning or sterilization, performance and regulatory work.
That depends on the defect size, contrast, working distance, field of view and display requirements. A sample image taken from the real inspection distance is more useful than resolution alone when deciding whether the module can reveal the required feature.
Provide the application, available tip diameter and length, target working distance, required field of view, output interface, host device, cable length, connector, LED-control requirements, operating environment, sample quantity and expected production volume.
Configure Your Imaging Module
Send us your available tip space, target working distance, host interface, cable and connector requirements, operating environment and expected volume. We will review the suitable camera-head, board and illumination configuration for sample evaluation.
A target image or sample device drawing helps speed up evaluation.
