In scenarios such as microelectronics manufacturing, precision machining, and medical device quality control, precision detection in ultra-narrow spaces has long been an industry pain point – traditional endoscopes are either too large in diameter to penetrate or suffer from blurred imaging and poor environmental adaptability. The SF-C016USB-D1.2 1.2mm ultra-slim LED endoscope camera module, however, stands out as the preferred solution for such scenarios with its core technical advantages.
Centered on the OmniVision OCHTA10 CMOS sensor and paired with an F/2.8 large-aperture optical lens, the module’s ultra-slim diameter of 1.2mm±0.05mm allows easy penetration into areas inaccessible to conventional tools, such as tiny pipes, equipment gaps, and dental root canals. In terms of optical performance, the 100°×100° wide field of view (FOV) combined with a low distortion design (<-11%) ensures consistent imaging from edge to center; the 0.175mm ultra-close focal length plus 3-30mm zoom range enables 25μm-level defect capture, meeting both micron-level detection and mid-range observation needs. Equipped with 4 high-brightness LED fill lights that adapt to low-light environments, the module features an IP67 dust and water resistance rating and a Steel Shell design, enabling stable long-term operation in harsh conditions such as humidity, oil contamination, and dust.
Connectivity and adaptability are equally impressive: the USB2.0 UVC protocol supports plug-and-play functionality without additional drivers, fully compatible with four major operating systems (Windows, macOS, Linux, Android), and the Mini USB-5P connector is adaptable to computers, industrial control terminals, and other devices. It also supports both integrated and Separated structural designs, allowing flexible selection based on the installation requirements of detection equipment. Certified by international standards including CE, FCC, and RoHS, the module’s basic tolerance of ±0.1mm guarantees reliable detection accuracy.
Recommended Application Scenarios:
Microelectronics Manufacturing: BGA solder ball defect detection, PCB micro-hole verification, and chip bonding quality monitoring;
Precision Machining: Swiss-type lathe tool wear monitoring, 5-axis machining center deep-cavity cleanliness inspection, and workpiece micro-crack detection;
Medical Device Quality Control: Endoscopic surgical robot channel cleanliness verification and polishing quality inspection of inner walls of metal tubes in minimally invasive instruments;
Pipeline and Ultra-Narrow Space Detection: Corrosion and crack detection in small sewers/oil pipes, dental root canal observation, etc.
If your detection scenario requires breaking through the three core demands of "ultra-narrow space penetration + high-precision imaging + harsh environment adaptation," the module’s core parameters and flexible adaptability can directly match technical indicators, making it a cost-effective selection that balances precision, stability, and compatibility.
