November 26, 2025 — Feiyinuo's Vicyto-6000 endoscope system, unveiled at MEDICA 2025, sets three hard requirements for upstream module vendors: distal outer diameter <5.8mm, latency <15ms, and 120° bendability, signaling medical endoscopes' entry into the "optical-electronic-computational integration" era.
Key Innovations:
Size limit: Using Wafer-Level Optics (WLO), module thickness shrinks to 0.35mm with 4.5mm axial dimension, enabling China's smallest scope design.
Edge computing shift: ISP removed from module; direct 2K@60fps RAW output to host FPGA for real-time processing, supporting instant switching of 5 optical modes.
Durability: Medical-grade silicone potting achieves IPX8 waterproofing, reduces thermal resistance to 8°C/W, and withstands 134°C sterilization.
Industry Impact: Module ASP jumps from $8-12 to $18-25, gross margins exceed 35%. Domestic CIS replaced Japanese solutions, projecting local market share to grow from 12% to 40% in three years.
Outlook: Next-gen modules will integrate edge NPU (0.5TOPS) and 0.5mm ultra-micro fiber optics. Vendors must evolve from "component suppliers" to "imaging solution providers."
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