Views: 0 Author: Site Editor Publish Time: 2025-06-10 Origin: Site
At present, when industrial endoscopes are upgraded to 4K/60fps, the power consumption of the chip surges. For instance, the power consumption of the IMX415 sensor reaches 1.2W, but the mirror tube with a diameter of ≤6mm limits the space for heat dissipation design. The actual measurement shows that after continuous operation for 15 minutes, the junction temperature of the chip can reach 85°C, resulting in a 30% increase in image noise and a 50% reduction in the lifespan of the LED.
Comparison of existing solutions
The representative technology of the solution type has a limited cooling effect. The passive heat dissipation copper foil heat conduction ring reduces the temperature by 8-12°C and increases the diameter by 0.5mm. The active heat dissipation micro voltage electric fan reduces the temperature by 15-20°C and requires 5V power supply. The material solution is aluminum nitride ceramic substrate, reducing the temperature by 10° C. The cost surges.
Innovation direction
Phase change material application: Paraffin-based composite materials (melting point 45°C) are filled between the PCB and the casing. It has been measured that the overheat alarm time can be delayed to 45 minutes
Dynamic power consumption management: By adjusting the frame rate through AI algorithms (automatically reducing to 30fps when detecting stationary objects), the peak power consumption is reduced by 20%
Laser microchannel: A 100μm wide cooling channel is etched on the stainless steel shell with a femtosecond laser. Combined with the circulation of inert gas, the heat dissipation efficiency is increased by four times
Industry trend: TI's TPS62824 power chip (with a conversion efficiency of 98%) to be launched in 2024 can reduce heat sources by 15% and is expected to become a standard feature of the next generation of modules.
