Views: 0 Author: Site Editor Publish Time: 2025-10-10 Origin: Site
In the design of separated endoscope camera modules, the connection method between the lens and the DSP board directly affects the product’s miniaturization capability, transmission stability, and scenario adaptability. Currently, the mainstream connection methods—wire bonding, MIPI/DVP interface, and Pin connector—exhibit significant differences due to their distinct technical principles, with their advantages and disadvantages being particularly critical in precision observation scenarios such as medical and industrial applications.
Wire Bonding Connection: Uses thin metal wires (e.g., gold wires, copper wires) to achieve circuit conduction between the lens module and the DSP board via a bonding process. It is a direct connection method without an interface, and the distance between connection points can be controlled at the micrometer level. Its core feature is high physical integration, with no additional space occupied by connectors.
MIPI/DVP Connection: Both are standardized image transmission interfaces. DVP is a parallel interface that transmits data synchronously through multiple signal lines; MIPI is a serial interface that uses differential signal transmission. Both require connection via flat cables and dedicated interface sockets, with interface sizes typically at the millimeter level.
Pin Connector Connection: Achieves conduction through physical contact between pins and sockets. The pin pitch is commonly 0.5-1.27mm, requiring reserved space for plugging/unplugging operations. Connection stability depends on pin contact pressure and coplanarity.
In terms of transmission essence, wire bonding is a "point-to-point" direct transmission, MIPI/DVP is "protocol-based interface" transmission, and Pin connectors are "detachable physical contact" transmission—creating inherent differences in signal loss, anti-interference capability, and more.
Ultimate Miniaturization Adaptability: The interface-free structure allows the lens diameter to be reduced to less than 2.8mm, meeting the needs of narrow-space applications such as medical minimally invasive procedures and precision mold detection. For example, OFILM’s urological endoscope modules break through volume limitations via wire bonding technology.
High Sealing and Reliability: The non-detachable structure can be combined with potting processes to achieve IP67 or higher protection levels, withstanding high-temperature and high-pressure sterilization—suitable for medical sterilization scenarios. It also has no contact wear issues, with a service life of up to tens of thousands of hours.
Cost-Effective for Low-Pixel Scenarios: For low-resolution modules (e.g., 0.08MP), signal loss in wire bonding is negligible, eliminating the need for additional signal amplification modules—reducing costs by 15%-30% compared to interface-based solutions.
Non-Repairability: Wire bonding is an irreversible connection; a single fault in the module or DSP board requires complete replacement, increasing long-term maintenance costs.
Limited Transmission Rate: The transmission rate of a single wire bond is usually less than 1Gbps, making it unsuitable for high-resolution image transmission (e.g., 4K).
Adaptability to High Speed and High Resolution: MIPI interfaces support dual-channel 2560x1600@60fps transmission, meeting needs such as industrial high-definition detection and 4K surgical imaging—far exceeding the rate limit of wire bonding.
Standardization and Compatibility: As a universal interface, it is compatible with DSP boards of different brands, reducing module replacement costs—especially suitable for mass production of multi-model equipment.
Strong Signal Anti-Interference: MIPI’s differential signal transmission effectively resists electromagnetic interference in industrial environments, with an image transmission signal-to-noise ratio more than 30% better than that of wire bonding.
Large Space Occupancy: Interface sockets and flat cables require at least 5mm×3mm of space, making it difficult to adapt to micro-lenses with diameters <5mm.
Higher Cost: Interface chips and flat cables increase the cost of a single module by 20%-40%, and additional signal matching circuits are required.
Convenient Maintenance and Replacement: The detachable structure allows separate replacement of the lens and DSP board, reducing maintenance time to minutes in industrial equipment inspections.
Low-Cost Iteration: No professional bonding equipment is needed for assembly, making it suitable for small-batch production—reducing prototype costs by 50% compared to wire bonding solutions.
Stability Risks: A pin bend of more than 0.015mm may cause poor contact, and signal interruptions are likely in vibrating environments—unsuitable for high-precision scenarios such as surgical robots.
Shortcomings in Size and Sealing: Gaps between pins and sockets make high-level sealing difficult, and the minimum installation space requires more than 8mm×5mm—preventing use in medical minimally invasive scenarios.
In medical scenarios such as dental root canal examinations and urological endoscopes, wire-bonded lenses with a 2.8mm diameter can penetrate physiological cavities. The steel shell protection combined with the wire-bonded sealing structure can withstand 121°C high-temperature sterilization. In disposable endoscopes, its non-detachable feature avoids cross-infection risks, while its cost advantage aligns with consumable needs. In industrial settings, for the detection of 3mm-wide runners in injection molds, the miniaturization advantage of wire-bonded modules reduces observation blind spots.
In automotive engine block detection, high-speed transmission via MIPI interfaces enables 1080P@60fps real-time imaging. Combined with a 105° wide-angle lens, it covers the entire internal structure of the engine block in one go, eliminating the need for frequent position adjustments. In surgical robot scenarios, MIPI’s anti-interference capability ensures delay-free transmission of 4K surgical images, supporting precise operations. For industrial detection equipment requiring frequent lens replacement, the standardized adaptability of DVP interfaces reduces equipment upgrade costs.
In air conditioner compressor pipeline maintenance, Pin-connected modules can be quickly plugged/unplugged for replacement, adapting to detection needs of different pipe diameters. Although minor signal fluctuations exist, it is sufficient for basic observation tasks such as pipeline blockage localization. In consumer electronics maintenance, its low-cost feature reduces the investment in maintenance equipment; combined with manual focusing, it enables motherboard solder joint detection—delivering significant cost-effectiveness.
